Polyimide 5000 series 30% glass fibre / Tecasint 5051

Starting with the base polymer TECASINT 5011, TECASINT 5051 with 30 % glass fibre has been developed. This material is characterised by reduced thermal elongation, reduced moisture absorption and high WITH 30 % GLASS FIBRE Starting with the base polymer TECASINT 5111, TECASINT 5051 with 30 % glass fibre has been developed. This material is characterised by reduced thermal elongation, reduced moisture absorption and high wear strength during chip test applications in the semiconductor industry. It has good electrical insulation properties and surface hardness, and also high rigidity. The glass transition temperature is 330°C, while the maximum service temperature may be – for a short time – up to 300 °C.