TWMND-72HD555

High-efficiency cell with advanced encapsulation technology Industry-leading module output Excellent power temperature coefficient -0.3%/℃, Cell lossless cutting+multi-busbar (MBB) /Super multi-busbar (SMBB) welding technology Effectively avoid the risk of microcracks Reliable frame design Meet the load requirements of 5400Pa (front) and 2400Pa (back) Easily coping with various application scenarios, 1% degradation in the first year, 0.4% annual degradation in the 2nd-30th year Provide long-term and stable power generation revenue for end customers Lower degradation with anti-PID cell and encapsulation materials